Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157817 | Chip-scale cooling device having through-silicon vias and flow directing features | Feng Zhou | 2018-12-18 |
| 10149413 | Integrated thermal management assembly for gate drivers and power components | Jongwon Shin, Jae Seung Lee | 2018-12-04 |
| 10121729 | Power electronics assemblies having a semiconductor device with metallized embedded cooling channels | Kyosuke Miyagi, Yuji Fukuoka | 2018-11-06 |
| 10083917 | Power electronics assemblies and vehicles incorporating the same | Shailesh N. Joshi, Yanghe Liu | 2018-09-25 |
| 10082047 | Rapid warm-up schemes of engine and engine coolant for higher fuel efficiency | Shailesh N. Joshi | 2018-09-25 |
| 10066876 | Vapor chamber heat flux rectifier and thermal switch | Feng Zhou, Mehdi Asheghi, James Palko, Kenneth E. Goodson | 2018-09-04 |
| 10032694 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Shailesh N. Joshi, Feng Zhou | 2018-07-24 |
| 10028413 | Heat transfer management apparatuses having a composite lamina | Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg | 2018-07-17 |
| 10020243 | Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system | Yuji Fukuoka, Shailesh N. Joshi, Feng Zhou | 2018-07-10 |
| 10011222 | On touch self-light growth steering wheel | Songtao Wu, Chi-Ming Wang, Khoa Vo, Debasish Banerjee | 2018-07-03 |
| 9990457 | Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations | Masanori Ishigaki, Danny J. Lohan | 2018-06-05 |
| 9980415 | Configurable double-sided modular jet impingement assemblies for electronics cooling | Feng Zhou | 2018-05-22 |
| 9974208 | Pool boiling system | Shailesh N. Joshi | 2018-05-15 |
| 9914337 | Vehicle with adsorption-based thermal battery | Feng Zhou | 2018-03-13 |
| 9869520 | Heat transfer management apparatuses having a composite lamina | Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg | 2018-01-16 |