TT

Tetsuyuki TSUCHIDA

NU National University Corporation Gunma University: 1 patents #6 of 29Top 25%
TC Toppan Printing Co.: 1 patents #34 of 111Top 35%
Overall (2018): #217,068 of 503,207Top 45%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9883586 Wiring substrate for bonding using solder having a low melting point and method for manufacturing same Toshikazu Okubo, Ikuo Shohji, Akihiro HIRATA 2018-01-30