Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9883586 | Wiring substrate for bonding using solder having a low melting point and method for manufacturing same | Tetsuyuki TSUCHIDA, Toshikazu Okubo, Akihiro HIRATA | 2018-01-30 |