Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115660 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2018-10-30 |
| 9892936 | Packaged semiconductor device having leadframe features preventing delamination | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2018-02-13 |