Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9892936 | Packaged semiconductor device having leadframe features preventing delamination | Wei Fen Sueann Lim, Anis Fauzi Bin Abdul Aziz | 2018-02-13 |
| 9859197 | Integrated circuit package fabrication | Sueann Lim Wei Fen, Sarel Bin Ismail | 2018-01-02 |