Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163847 | Method for producing semiconductor package | Makoto Orikasa, Hideyuki Seike, Hisayuki Abe | 2018-12-25 |
YH
Yuhei Horikawa
Overall (2018): #179,051 of 503,207Top 40%
1
Patents 2018