Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163847 | Method for producing semiconductor package | Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2018-12-25 |
| D816639 | Microphone for wireless communications device | — | 2018-05-01 |