Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163897 | Inter-level connection for multi-layer structures | Clement Hsingjen Wann, Neng-Kuo Chen | 2018-12-25 |
| 10157914 | Multi-layer semiconductor device structure | Yasutoshi Okuno | 2018-12-18 |
| 10128269 | Systems and methods for a semiconductor structure having multiple semiconductor-device layers | Chun Hsiung Tsai, Clement Hsingjen Wann | 2018-11-13 |
| 10062601 | Systems and methods for a semiconductor structure having multiple semiconductor-device layers | Chun Hsiung Tsai, Clement Hsingjen Wann | 2018-08-28 |
| 9953975 | Methods for forming STI regions in integrated circuits | Chih-Yu Hsu, Clement Hsinjen Wann, Chih-Sheng Chang, Wei-Chun Tsai, Jyh-Cherng Sheu +1 more | 2018-04-24 |
| 9929158 | Systems and methods for integrating different channel materials into a CMOS circuit by using a semiconductor structure having multiple transistor layers | Clement Hsingjen Wann | 2018-03-27 |
| 9929133 | Semiconductor logic circuits fabricated using multi-layer structures | Clement Hsingjen Wann | 2018-03-27 |
| 9917192 | Structure and method for transistors with line end extension | Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang +2 more | 2018-03-13 |
| 9911850 | FinFETs and the methods for forming the same | Chia-Cheng Ho, Tzu-Chiang Chen, Chih-Sheng Chang | 2018-03-06 |
| 9893056 | Multi-layer semiconductor device structure | Yasutoshi Okuno | 2018-02-13 |