Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155659 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Hung-Chia Tsai, Chia-Hua Chu | 2018-12-18 |
| 9919914 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2018-03-20 |