Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997401 | Method for forming a via profile of interconnect structure of semiconductor device structure | Che-Cheng Chang, Tai-Shin Cheng, Wei-Ting Chen | 2018-06-12 |
WS
Wei-Yin Shiao
Overall (2018): #196,341 of 503,207Top 40%
1
Patents 2018