Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997401 | Method for forming a via profile of interconnect structure of semiconductor device structure | Wei-Yin Shiao, Che-Cheng Chang, Wei-Ting Chen | 2018-06-12 |
| 9997520 | Semiconductor device structure with capacitor and method for forming the same | Che-Cheng Chang | 2018-06-12 |