Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157990 | Semiconductor device with capping structure and method of forming the same | Chung-Ming Wang | 2018-12-18 |
| 10050103 | Method of forming semiconductor structures including metal insulator metal capacitor | Ren-Wei Xiao, Sheng-Yu Lin, Chia-Wei Liu, Chun Hua Chang, Chien-Ying Wu | 2018-08-14 |
| 9984971 | Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers | Chung-Chuan Tseng, Chia-Wei Liu, Ren-Wei Xiao | 2018-05-29 |
| 9947701 | Low noise device and method of forming the same | Victor Chiang Liang, Fu-Huan Tsai, Meng-Chang Ho, Yu-Lin Wei, Chi-Feng Huang | 2018-04-17 |