Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984971 | Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers | Chia-Wei Liu, Fang-Ting Kuo, Ren-Wei Xiao | 2018-05-29 |
| 9905466 | Wafer partitioning method and device formed | Wei Huang, Chia-Wei Liu, Li-Hsin Chu | 2018-02-27 |
| 9871067 | Infrared image sensor component | Chien-Ying Wu, Li-Hsin Chu, Chia-Wei Liu | 2018-01-16 |