Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9928334 | Redistribution layer routing for integrated fan-out wafer-level chip-scale packages | Bo-Qiao Lin, Ting-Chou Lin, Yao-Wen Chang | 2018-03-27 |
| 9882046 | Ultra high voltage semiconductor device with electrostatic discharge capabilities | Tsai-Feng Yang, Chih-Heng Shen, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2018-01-30 |