Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9928334 | Redistribution layer routing for integrated fan-out wafer-level chip-scale packages | Ting-Chou Lin, Chun-Yi Yang, Yao-Wen Chang | 2018-03-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9928334 | Redistribution layer routing for integrated fan-out wafer-level chip-scale packages | Ting-Chou Lin, Chun-Yi Yang, Yao-Wen Chang | 2018-03-27 |