Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163801 | Structure and formation method of chip package with fan-out structure | Tin-Hao Kuo | 2018-12-25 |
| 9929070 | Isolation rings for packages and the method of forming the same | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2018-03-27 |