Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103117 | Method of manufacturing fan-out type wafer level package | Hyun Hak Jung, Eun Dong Kim, Jong Won Lee, Byeong Ho Jeong | 2018-10-16 |
| 10050499 | Method of manufacturing voice coil | Eun Dong Kim, Hyun Hak Jung, Hyeong Min KIM, Jong Hwi Jung, Su Kyung Lim | 2018-08-14 |
| 9935072 | Semiconductor package and method for manufacturing the same | Byeong Ho Jeong, Eun Dong Kim, Jong Won Lee, Hyun Hak Jung | 2018-04-03 |
| 9905436 | Wafer level fan-out package and method for manufacturing the same | You Jin Oh, Eun Dong Kim, Jong Won Lee | 2018-02-27 |
| 9905551 | Method of manufacturing wafer level packaging including through encapsulation vias | Eun Dong Kim, Jong Won Lee | 2018-02-27 |