Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103117 | Method of manufacturing fan-out type wafer level package | Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi, Byeong Ho Jeong | 2018-10-16 |
| 10050499 | Method of manufacturing voice coil | Jai Kyoung Choi, Eun Dong Kim, Hyeong Min KIM, Jong Hwi Jung, Su Kyung Lim | 2018-08-14 |
| 9935072 | Semiconductor package and method for manufacturing the same | Byeong Ho Jeong, Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi | 2018-04-03 |