Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10046158 | Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates | John J. Janik, Edward Chia Ning Tang, James Bernard Dunlop, Leland Joseph Spangler | 2018-08-14 |