Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10046158 | Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates | John J. Janik, Rob Brindley, Edward Chia Ning Tang, Leland Joseph Spangler | 2018-08-14 |
| 9950154 | Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates | Robert Brindley, John J. Janik, Edward Chia Ning Tang, Joseph Leland Spangler | 2018-04-24 |