Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997431 | Electronic device provided with a thermal dissipation member | Rafael Augusto Prieto Herrera, Jean-Philippe Colonna | 2018-06-12 |
| 9870947 | Method for collective (wafer-scale) fabrication of electronic devices and electronic device | Didier CAMPOS, Benoit Besancon, Jean-Philippe Colonna | 2018-01-16 |