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Matteo DE SANTA

SSStmicroelectronics Sa: 1 patents #152 of 491Top 35%
Tiggiano, IT: #1 of 1 inventorsTop 100%
Overall (2018): #323,033 of 503,207Top 65%
1 Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10141197 Thermosonically bonded connection for flip chip packages Mauro MAZZOLA, Battista Vitali 2018-11-27

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