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Battista Vitali

SSStmicroelectronics Sa: 1 patents #152 of 491Top 35%
Romano di Lombardia, IT: #2 of 3 inventorsTop 70%
Overall (2018): #477,953 of 503,207Top 95%
1 Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10141197 Thermosonically bonded connection for flip chip packages Mauro MAZZOLA, Matteo DE SANTA 2018-11-27

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