Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068877 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2018-09-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068877 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2018-09-04 |