Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163744 | Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure | OhHan Kim, WonJun Ko | 2018-12-25 |
| 10068877 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, Kyoungll Huh | 2018-09-04 |