Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922965 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Hyeong-Seok Choi | 2018-03-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922965 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Hyeong-Seok Choi | 2018-03-20 |