Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10050019 | Method of manufacturing wafer level package and wafer level package manufactured thereby | Tae Hoon Kim, Jong Hoon Kim, Dae Won Kim | 2018-08-14 |
| 9922965 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Young Geun Yoo | 2018-03-20 |