Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163662 | Fabrication method of semiconductor package | Cheng-Chia Chiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang | 2018-12-25 |
| 10115712 | Electronic module | Shao-Chueh Hu, Yueh-Chiung Chang | 2018-10-30 |