Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163662 | Fabrication method of semiconductor package | Don-Son Jiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang | 2018-12-25 |
| 9905546 | Package on package structure and fabrication method thereof | Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Chu-Huei Huang | 2018-02-27 |