Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10028393 | Wiring substrate and semiconductor package | Noriyoshi Shimizu, Akio Rokugawa | 2018-07-17 |
| 9961760 | Wiring substrate | Yuta Sakaguchi, Noriyoshi Shimizu | 2018-05-01 |
| 9875957 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Jun Furuichi, Akio Rokugawa, Takashi Ito | 2018-01-23 |