Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10028393 | Wiring substrate and semiconductor package | Noriyoshi Shimizu, Yusuke Gozu | 2018-07-17 |
| 9875957 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Yusuke Gozu, Jun Furuichi, Takashi Ito | 2018-01-23 |