Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10159166 | Heat dissipating structure | Yuji Morinaga, Osamu Matsuzaki | 2018-12-18 |
| 10070523 | Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same | Shunsuke Sakai, Toshiki Furutani, Takema Adachi, Takayuki Katsuno | 2018-09-04 |
| 9997437 | Power semiconductor module for improved thermal performance | — | 2018-06-12 |
| 9991184 | Electronic module and method of manufacturing the same | — | 2018-06-05 |
| 9892993 | Semiconductor module having stacked insulated substrate structures | — | 2018-02-13 |
| 9871788 | Authentication terminal | Katsuhiko Degawa, Kengo Suzuki, Yushi Nishino, Masakatsu Suda | 2018-01-16 |
| 9871789 | Authentication system, authentication method and service providing system | Katsuhiko Degawa, Kengo Suzuki, Yushi Nishino, Masakatsu Suda | 2018-01-16 |