Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098243 | Printed wiring board and semiconductor package | Yuki Yoshikawa | 2018-10-09 |
| 10070523 | Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same | Shunsuke Sakai, Kosuke Ikeda, Takema Adachi, Takayuki Katsuno | 2018-09-04 |
| 9951434 | Printed wiring board, semiconductor package and method for manufacturing printed wiring board | Yuki Yoshikawa | 2018-04-24 |
| 9883592 | Wiring board and method for manufacturing the same | Yukinobu Mikado, Toyotaka Shimabe, Shinobu Kato | 2018-01-30 |
| 9859221 | Multilayer wiring board with built-in electronic component | Toyotaka Shimabe, Shunsuke Sakai | 2018-01-02 |