Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137538 | Liquid coating device | Manabu Muraoka, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara +3 more | 2018-11-27 |
| 10111342 | Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet | Kaichi Tsuruta, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara | 2018-10-23 |