Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10111342 | Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet | Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita | 2018-10-23 |
| 10005938 | Thermosensitive adhesive | Minoru Nanchi, Koji Yamashita, Ayumi Nagao | 2018-06-26 |