Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134698 | Bonding pad structure, bonding ring structure, and MEMS device packaging method | Linbo Shi, Yao-Hong Liu | 2018-11-20 |
| 10074650 | Deep trench isolation for RF devices on SOI | Herb He Huang, Haiting Li, Xingcheng Jin, Xinxue Wang, Hongbo Zhao +1 more | 2018-09-11 |
| 9971430 | Touch panel | Pu-Hsin Chang, Jui-Hsing Li, Manyi Lin, Pudi Hong, Tsai-Kuai Wei +3 more | 2018-05-15 |