Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134698 | Bonding pad structure, bonding ring structure, and MEMS device packaging method | Fucheng Chen, Yao-Hong Liu | 2018-11-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134698 | Bonding pad structure, bonding ring structure, and MEMS device packaging method | Fucheng Chen, Yao-Hong Liu | 2018-11-20 |