Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Hsin-Chang Tsai, Peng-Hsin Lee, Shiau-Shi Lin | 2018-08-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Hsin-Chang Tsai, Peng-Hsin Lee, Shiau-Shi Lin | 2018-08-21 |