Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Hsin-Chang Tsai, Shiau-Shi Lin, Tzu-Hsuan Cheng | 2018-08-21 |
| 9905439 | Power module package having patterned insulation metal substrate | Hsin-Chang Tsai, Chia-Yen Lee | 2018-02-27 |
| 9865531 | Power module package having patterned insulation metal substrate | Hsin-Chang Tsai, Chia-Yen Lee | 2018-01-09 |