Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163766 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | Darrell D. Truhitte | 2018-12-25 |
| 10103072 | Damaging components with defective electrical couplings | Darrell D. Truhitte | 2018-10-16 |
| 9899349 | Semiconductor packages and related methods | Phillip Celaya, Robert L. Marquis, Darrell D. Truhitte | 2018-02-20 |
| 9892952 | Wafer level flat no-lead semiconductor packages and methods of manufacture | Darrell D. Truhitte | 2018-02-13 |