Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163766 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | James P. Letterman, Jr. | 2018-12-25 |
| 10103072 | Damaging components with defective electrical couplings | James P. Letterman, Jr. | 2018-10-16 |
| 10093468 | Carrier tape with standoff units | — | 2018-10-09 |
| 9899349 | Semiconductor packages and related methods | Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis | 2018-02-20 |
| 9892952 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2018-02-13 |