Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150890 | CMP slurry composition for polishing copper and polishing method using the same | Jeong Hwan Jeong, Dong-Hun Kang, Tae Wan Kim, Jong Il Noh, Chang-Ki Hong | 2018-12-11 |
| 10100225 | CMP slurry composition for metal wiring and polishing method using the same | So-Hyung Lee, Keun Bong Do, Dong Jin Kim, Kang Su AN | 2018-10-16 |