Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150890 | CMP slurry composition for polishing copper and polishing method using the same | Jeong Hwan Jeong, Young Chul Jung, Dong-Hun Kang, Tae Wan Kim, Jong Il Noh | 2018-12-11 |