Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147616 | Package frame and method of manufacturing semiconductor package using the same | Geunwoo KIM, Keunho Jang, Younjo Mun | 2018-12-04 |
| 10134666 | Package substrate, method for fabricating the same, and package device including the package substrate | Kyujin Lee | 2018-11-20 |
| 9960107 | Package substrate, method for fabricating the same, and package device including the package substrate | Kyujin Lee | 2018-05-01 |