Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147616 | Package frame and method of manufacturing semiconductor package using the same | Soojae Park, Keunho Jang, Younjo Mun | 2018-12-04 |
| 9881827 | Substrate treating apparatus and substrate treating method | Seunghee Lee, Hyun Joo Kim, Ohchul Kwon, Sangho An, Seonju Oh +1 more | 2018-01-30 |