Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929098 | Copper via with barrier layer and cap layer | Tae Jin Yim, Sang-Hoon Ahn, Thomas Oszinda, Jong-Min Baek, Byung-Hee Kim +1 more | 2018-03-27 |
KJ
Kee-Young Jun
Overall (2018): #345,377 of 503,207Top 70%
1
Patents 2018