JS

Jae Bong Shin

Samsung: 1 patents #6,546 of 15,403Top 45%
📍 Gunpo-si, KR: #47 of 128 inventorsTop 40%
Overall (2018): #380,487 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10058952 Bonding stage and bonding apparatus comprising the same Seung Dae Seok, Sang-Yoon Kim, Hui-Jae Kim, Byung Joon LEE 2018-08-28