Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10058952 | Bonding stage and bonding apparatus comprising the same | Seung Dae Seok, Sang-Yoon Kim, Hui-Jae Kim, Jae Bong Shin | 2018-08-28 |
| 9954775 | Software-defined network (SDN) system using host abstraction, and method for implementing the same | Sae Hyong PARK, Ji Soo SHIN, Tae Hong Kim, Jae-ho You | 2018-04-24 |