Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10160637 | Molded lead frame package with embedded die | Jay Scott Salmon | 2018-12-25 |
UH
Uwe Hansen
Overall (2018): #203,310 of 503,207Top 45%
1
Patents 2018