Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10160637 | Molded lead frame package with embedded die | Uwe Hansen | 2018-12-25 |
| 10120020 | Probe head assemblies and probe systems for testing integrated circuit devices | Roy E. Swart, Brandon Liew | 2018-11-06 |
| 10057688 | Lead frame-based chip carrier used in the fabrication of MEMS transducer packages | — | 2018-08-21 |
| 10028068 | Metalized microphone lid with integrated wire bonding shelf | — | 2018-07-17 |
| 9961452 | MEMS microphone package | — | 2018-05-01 |
| 9894444 | Microphone package with molded spacer | Kuldeep Saxena | 2018-02-13 |